Method for forming chip structure with conductive structure

ABSTRACT

A method for forming a chip structure is provided. The method includes providing a semiconductor substrate, a first conductive line, and a first dielectric layer. The method includes forming a first conductive layer over the first dielectric layer. The method includes forming a second conductive layer over the first conductive layer. The method includes forming a second dielectric layer over the second conductive layer and the first conductive layer. The method includes forming a first through hole passing through the second dielectric layer, the first conductive layer, and the first dielectric layer. The method includes forming a first conductive structure in and over the first through hole.

CROSS REFERENCE

This application is a Divisional of U.S. application Ser. No.16/655,998, filed on Oct. 17, 2019, the entirety of which isincorporated by reference herein.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experienced rapidgrowth. Technological advances in IC materials and design have producedgenerations of ICs. Each generation has smaller and more complexcircuits than the previous generation. However, these advances haveincreased the complexity of processing and manufacturing ICs.

In the course of IC evolution, functional density (i.e., the number ofinterconnected devices per chip area) has generally increased whilegeometric size (i.e., the smallest component (or line) that can becreated using a fabrication process) has decreased. This scaling-downprocess generally provides benefits by increasing production efficiencyand lowering associated costs.

However, since feature sizes continue to decrease, fabrication processescontinue to become more difficult to perform. Therefore, it is achallenge to form reliable semiconductor devices at smaller and smallersizes.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It shouldbe noted that, in accordance with standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1A-1 to FIG. 1H-1 are cross-sectional views of various stages of aprocess for forming a chip structure, in accordance with someembodiments.

FIGS. 1A-2 to FIGS. 1C-2 and FIGS. 1E-2 to FIGS. 1F-2 are top viewsillustrating the chip structure in FIGS. 1A-1 to FIGS. 1C-1 and FIGS.1E-1 to FIGS. 1F-1, in accordance with some embodiments.

FIG. 2A is a cross-sectional view of a chip structure, in accordancewith some embodiments.

FIG. 2B is a top view of the chip structure of FIG. 2A, in accordancewith some embodiments.

FIG. 3A-1 to FIG. 3F-1 are cross-sectional views of various stages of aprocess for forming a chip structure, in accordance with someembodiments.

FIG. 3A-2 to FIG. 3E-2 are top views illustrating the chip structure inFIG. 3A-1 to FIG. 3E-1, in accordance with some embodiments.

FIG. 4 is a top view of a conductive layer of FIG. 3A-1, in accordancewith some embodiments.

FIG. 5 is a top view of a conductive layer of FIG. 3A-1, in accordancewith some embodiments.

FIG. 6 is a top view of a conductive layer of FIG. 3A-1, in accordancewith some embodiments.

FIG. 7A-1 to FIG. 7F-1 are top views of various stages of a process forforming a chip structure, in accordance with some embodiments.

FIG. 7A-2 to FIG. 7F-2 are cross-sectional views illustrating the chipstructure along a sectional line I-I in FIG. 7A-1 to FIG. 7F-1, inaccordance with some embodiments.

FIG. 7A-3 to FIG. 7F-3 are cross-sectional views illustrating the chipstructure along a sectional line II-II in FIG. 7A-1 to FIG. 7F-1, inaccordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the subject matterprovided. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Furthermore, spatially relative terms, such as “beneath,” “below,”“lower,” “above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly. It should be understoodthat additional operations can be provided before, during, and after themethod, and some of the operations described can be replaced oreliminated for other embodiments of the method.

Some embodiments of the disclosure are described. Additional operationscan be provided before, during, and/or after the stages described inthese embodiments. Some of the stages that are described can be replacedor eliminated for different embodiments. Additional features can beadded to the chip structure. Some of the features described below can bereplaced or eliminated for different embodiments. Although someembodiments are discussed with operations performed in a particularorder, these operations may be performed in another logical order.

FIG. 1A-1 to FIG. 1H-1 are cross-sectional views of various stages of aprocess for forming a chip structure, in accordance with someembodiments. FIGS. 1A-2 to FIGS. 1C-2 and FIGS. 1E-2 to FIGS. 1F-2 aretop views illustrating the chip structure in FIGS. 1A-1 to FIGS. 1C-1and FIGS. 1E-1 to FIGS. 1F-1, in accordance with some embodiments.

As shown in FIG. 1A-1, a substrate 110 is provided, in accordance withsome embodiments. The substrate 110 includes, for example, asemiconductor substrate. The semiconductor substrate includes, forexample, a semiconductor wafer (such as a silicon wafer) or a portion ofa semiconductor wafer.

In some embodiments, the substrate 110 is made of an elementarysemiconductor material including silicon or germanium in a singlecrystal, polycrystal, or amorphous structure. In some other embodiments,the substrate 110 is made of a compound semiconductor, such as siliconcarbide, gallium arsenide, gallium phosphide, indium phosphide, indiumarsenide, an alloy semiconductor, such as SiGe, or GaAsP, or acombination thereof. The substrate 110 may also include multi-layersemiconductors, semiconductor on insulator (SOI) (such as silicon oninsulator or germanium on insulator), or a combination thereof.

In some embodiments, the substrate 110 is a device wafer that includesvarious device elements. In some embodiments, the various deviceelements are formed in and/or over the substrate 110. The deviceelements are not shown in figures for the purpose of simplicity andclarity. Examples of the various device elements include active devices,passive devices, other suitable elements, or a combination thereof. Theactive devices may include transistors or diodes (not shown) formed at asurface 112 of the substrate 110. The passive devices include resistors,capacitors, or other suitable passive devices.

For example, the transistors may be metal oxide semiconductor fieldeffect transistors (MOSFET), complementary metal oxide semiconductor(CMOS) transistors, bipolar junction transistors (BJT), high-voltagetransistors, high-frequency transistors, p-channel and/or n-channelfield effect transistors (PFETs/NFETs), etc. Various processes, such asfront-end-of-line (FEOL) semiconductor fabrication processes, areperformed to form the various device elements. The FEOL semiconductorfabrication processes may include deposition, etching, implantation,photolithography, annealing, planarization, one or more other applicableprocesses, or a combination thereof.

In some embodiments, isolation features (not shown) are formed in thesubstrate 110. The isolation features are used to define active regionsand electrically isolate various device elements formed in and/or overthe substrate 110 in the active regions. In some embodiments, theisolation features include shallow trench isolation (STI) features,local oxidation of silicon (LOCOS) features, other suitable isolationfeatures, or a combination thereof.

As shown in FIG. 1A-1, an interconnect structure 120 is formed over thesubstrate 110, in accordance with some embodiments. The interconnectstructure 120 includes a dielectric structure 122, wiring layers 124,and conductive vias 126, in accordance with some embodiments. Thedielectric structure 122 may include dielectric layers (not shown)stacked over the substrate 110, in accordance with some embodiments.

The wiring layers 124 and the conductive vias 126 are in the dielectricstructure 122, in accordance with some embodiments. The wiring layers124 are spaced apart from each other, in accordance with someembodiments. The wiring layers 124 has a thickness T1 ranging from about1000 Å to about 4000 Å, in accordance with some embodiments. Theconductive vias 126 are electrically connected between different wiringlayers 124 and between the wiring layer 124 and the device elements (notshown) formed at the surface 112 of the substrate 110, in accordancewith some embodiments.

The dielectric structure 122 is made of an insulating material, such asoxides (e.g., silicon oxide), nitrides (e.g., silicon nitride or siliconoxynitride), silicon carbide, un-doped silicate glass (USG), or a low-kdielectric material with a k-value lower than that of silicon oxide, inaccordance with some embodiments. The wiring layers 124 and theconductive vias 126 are made of metal (e.g., copper, aluminum, gold,silver, or tungsten) or alloy thereof, in accordance with someembodiments.

As shown in FIG. 1A-1, a dielectric layer 132 and a wiring layer 134 areformed over the interconnect structure 120, in accordance with someembodiments. The wiring layer 134 is formed in the dielectric layer 132,in accordance with some embodiments. The wiring layer 134 is alsoreferred to as a top metal layer, in accordance with some embodiments.The wiring layer 134 includes a seed layer 134 a and a conductive layer134 b, in accordance with some embodiments.

The conductive layer 134 b is formed over the seed layer 134 a, inaccordance with some embodiments. The wiring layer 134 includesconductive lines 134 c, 134 d, and 134 e, in accordance with someembodiments. The conductive vias 126 are electrically connected betweenthe wiring layer 124 and the wiring layer 134, in accordance with someembodiments. The wiring layer 134 is thicker than each wiring layer 124,in accordance with some embodiments. The wiring layer 134 (or thedielectric layer 132) has a thickness T2 ranging from about 5000 Å toabout 13000 Å, in accordance with some embodiments.

The dielectric structure 132 is made of an insulating material, such asoxides (e.g., silicon oxide), nitrides (e.g., silicon nitride or siliconoxynitride), or un-doped silicate glass (USG), in accordance with someembodiments. The seed layer 134 a and the conductive layer 134 b aremade of metal (e.g., copper, aluminum, gold, silver, or tungsten) oralloy thereof, in accordance with some embodiments.

The seed layer 134 a is formed using a deposition process, such as aphysical vapor deposition process or a chemical vapor depositionprocess, in accordance with some embodiments. The conductive layer 134 bis formed using a plating process, such as an electroplating process, inaccordance with some embodiments. In some embodiments (not shown), abarrier layer is formed between the seed layer 134 a and the dielectriclayer 132 and between the seed layer 134 a and the dielectric structure122. The barrier layer is made of nitrides, such as tantalum nitride, inaccordance with some embodiments.

As shown in FIG. 1A-1, an etch stop layer 140 is formed over thedielectric structure 132 and the wiring layer 134, in accordance withsome embodiments. The etch stop layer 140 is thinner than the wiringlayer 134 or the dielectric layer 132, in accordance with someembodiments. The etch stop layer 140 has a thickness T3 ranging fromabout 400 Å to about 1100 Å, in accordance with some embodiments.

The etch stop layer 140 is made of nitrides (e.g., silicon nitride orsilicon oxynitride), in accordance with some embodiments. The etch stoplayer 140 is formed using a deposition process, such as a chemical vapordeposition process or a physical vapor deposition process, in accordancewith some embodiments.

As shown in FIGS. 1A-1 and 1A-2, a dielectric layer 150 is formed overthe etch stop layer 140, in accordance with some embodiments. Thedielectric layer 150 is thinner than the wiring layer 134 or thedielectric layer 132, in accordance with some embodiments. Thedielectric layer 150 has a thickness T4 ranging from about 3000 Å toabout 5000 Å, in accordance with some embodiments.

The dielectric layer 150 is made of an insulating material, such asoxides (e.g., silicon oxide), nitrides (e.g., silicon nitride or siliconoxynitride), or un-doped silicate glass (USG), in accordance with someembodiments. The dielectric layer 150 is formed using a depositionprocess, such as a chemical vapor deposition process (e.g., a plasmaenhanced chemical vapor deposition (PECVD) process) or a physical vapordeposition process, in accordance with some embodiments.

As shown in FIGS. 1A-1 and 1A-2, a conductive layer 160 is formed overthe dielectric layer 150, in accordance with some embodiments. Theconductive layer 160 is used as a capacitor electrode, in accordancewith some embodiments. The conductive layer 160 has an opening 162, inaccordance with some embodiments. The opening 162 exposes a portion ofthe dielectric layer 150, in accordance with some embodiments.

The conductive layer 160 is thinner than the wiring layer 134, thedielectric layer 132, or the dielectric layer 150, in accordance withsome embodiments. The conductive layer 160 has a thickness T5 rangingfrom about 100 Å to about 800 Å, in accordance with some embodiments.The thickness T5 ranges from about 200 Å to about 700 Å, in accordancewith some embodiments.

The conductive layer 160 is made of a capacitor electrode material, inaccordance with some embodiments. The capacitor electrode materialincludes metal (e.g., copper, aluminum, gold, silver, or tungsten),alloy thereof, nitrides (e.g., titanium nitride), or another suitablecapacitor electrode material, in accordance with some embodiments.

The conductive layer 160 is formed using a deposition process (e.g., aphysical vapor deposition process or a chemical vapor depositionprocess), a photolithography process, an etching process, and anoptional cleaning and passivation process, in accordance with someembodiments. The cleaning and passivation process is used to clean theresidues from the photolithography process and to passivate the surfaceof the conductive layer 160, in accordance with some embodiments. Thecleaning and passivation process includes a plasma process using N₂O orAr as a process gas, in accordance with some embodiments.

As shown in FIGS. 1B-1 and 1B-2, a dielectric layer 170 is formed overthe conductive layer 160 and the dielectric layer 150, in accordancewith some embodiments. The dielectric layer 170 is used as a capacitordielectric layer, in accordance with some embodiments. The dielectriclayer 170 is thinner than the dielectric layer 150 or the conductivelayer 160, in accordance with some embodiments. The dielectric layer 170has a thickness T6 ranging from about 10 Å to about 200 Å, in accordancewith some embodiments.

In some embodiments, the dielectric layer 170 is a single-layeredstructure. In some other embodiments, the dielectric layer 170 is amulti-layered structure. The multi-layered structure has layers, andeach layer is made of a material different from that of adjacentlayer(s), in accordance with some embodiments.

The dielectric layer 170 is made of a capacitor dielectric material,such as a high dielectric constant (high-k) material, in accordance withsome embodiments. The high-k material is made of metal oxides, such aszirconium oxide (ZrO₂), hafnium oxide (HfO₂), hafnium silicon oxide(HfSiO), hafnium silicon oxynitride (HfSiON), hafnium tantalum oxide(HfTaO), hafnium titanium oxide (HMO), hafnium zirconium oxide (HfZrO),aluminum oxide (Al₂O₃), hafnium dioxide-alumina (HfO₂—Al₂O₃) alloy, orcombinations thereof, in accordance with some embodiments.

In some other embodiments, the high-k material is made of metalnitrides, metal silicates, transition metal-oxides, transitionmetal-nitrides, transition metal-silicates, oxynitrides of metals, othersuitable materials, or combinations thereof. The dielectric layer 170 isformed using a deposition process, such as a chemical vapor deposition(CVD) process, a thermal atomic layer deposition (ALD) process, a plasmaenhanced atomic layer deposition (PEALD) process, or another suitabledeposition process.

As shown in FIGS. 1B-1 and 1B-2, a conductive layer 180 is formed overthe dielectric layer 170, in accordance with some embodiments. Theconductive layer 180 includes a conductive film 182 and a dummy film184, in accordance with some embodiments. The conductive film 182 isused as a capacitor electrode, in accordance with some embodiments.

The conductive film 182 has an opening 182 a, in accordance with someembodiments. The opening 182 a exposes a portion of the dielectric layer170, in accordance with some embodiments. The conductive film 182partially overlaps the conductive layer 160, in accordance with someembodiments. The conductive film 182 is separated from the conductivelayer 160 by the dielectric layer 170, in accordance with someembodiments.

The dummy film 184 is used as an etch buffer layer in a subsequentthrough-hole etching process, in accordance with some embodiments. Theconductive film 182 and the dummy film 184 are spaced apart from eachother, in accordance with some embodiments. The conductive film 182 andthe dummy film 184 are electrically insulated from each other, inaccordance with some embodiments.

The conductive layer 180 is thinner than the wiring layer 134, thedielectric layer 132, or the dielectric layer 150, in accordance withsome embodiments. The conductive layer 180 is thicker than thedielectric layer 170, in accordance with some embodiments. Theconductive layer 180 has a thickness T7 ranging from about 100 Å toabout 800 Å, in accordance with some embodiments. The thickness T7ranges from about 200 Å to about 700 Å, in accordance with someembodiments.

The conductive layer 180 is made of a capacitor electrode material, inaccordance with some embodiments. The capacitor electrode materialincludes metal (e.g., copper, aluminum, gold, silver, or tungsten),alloy thereof, nitrides (e.g., titanium nitride), or another suitablecapacitor electrode material, in accordance with some embodiments.

The conductive layer 180 is formed using a deposition process (e.g., aphysical vapor deposition process or a chemical vapor depositionprocess), a photolithography process, an etching process, and anoptional cleaning and passivation process, in accordance with someembodiments. The cleaning and passivation process is used to clean theresidues from the photolithography process and to passivate the surfaceof the conductive layer 180, in accordance with some embodiments. Thecleaning and passivation process includes a plasma process using N₂O orAr as a process gas, in accordance with some embodiments.

As shown in FIGS. 1C-1 and 1C-2, a dielectric layer 190 is formed overthe conductive layer 180 and the dielectric layer 170, in accordancewith some embodiments. The dielectric layer 190 is used as a capacitordielectric layer, in accordance with some embodiments. The dielectriclayer 190 is thinner than the dielectric layer 150 or the conductivelayer 160 or 180, in accordance with some embodiments. The dielectriclayer 190 has a thickness T8 ranging from about 10 Å to about 200 Å, inaccordance with some embodiments.

In some embodiments, the dielectric layer 190 is a single-layeredstructure. In some other embodiments, the dielectric layer 190 is amulti-layered structure. The multi-layered structure has layers, andeach layer is made of a material different from that of adjacentlayer(s), in accordance with some embodiments.

The dielectric layer 190 is made of a capacitor dielectric material,such as a high dielectric constant (high-k) material, in accordance withsome embodiments. The high-k material is made of metal oxides, such aszirconium oxide (ZrO₂), hafnium oxide (HfO₂), hafnium silicon oxide(HfSiO), hafnium silicon oxynitride (HfSiON), hafnium tantalum oxide(HfTaO), hafnium titanium oxide (HMO), hafnium zirconium oxide (HfZrO),aluminum oxide (Al₂O₃), hafnium dioxide-alumina (HfO₂—Al₂O₃) alloy, orcombinations thereof, in accordance with some embodiments.

In some other embodiments, the high-k material is made of metalnitrides, metal silicates, transition metal-oxides, transitionmetal-nitrides, transition metal-silicates, oxynitrides of metals, othersuitable materials, or combinations thereof. The dielectric layer 190 isformed using a deposition process, such as a chemical vapor deposition(CVD) process, a thermal atomic layer deposition (ALD) process, a plasmaenhanced atomic layer deposition (PEALD) process, or another suitabledeposition process.

As shown in FIGS. 1C-1 and 1C-2, a conductive layer 210 is formed overthe dielectric layer 190, in accordance with some embodiments. Theconductive layer 210 includes a conductive film 212 and dummy films 214and 216, in accordance with some embodiments. The conductive film 212 isused as a capacitor electrode, in accordance with some embodiments. Theconductive film 212 has an opening 212 a, in accordance with someembodiments. The opening 212 a exposes a portion of the dielectric layer190, in accordance with some embodiments.

The conductive layer 210 partially overlaps the conductive layer 180, inaccordance with some embodiments. The conductive film 212 overlaps theconductive film 182, in accordance with some embodiments. The dummy film214 overlaps the dummy film 184, in accordance with some embodiments.The conductive layer 210 is separated from the conductive layer 180 bythe dielectric layer 190, in accordance with some embodiments.

The dummy films 214 and 216 are used as an etch buffer layer in asubsequent through-hole etching process, in accordance with someembodiments. The dummy film 216 is in the opening 212 a, in accordancewith some embodiments. The conductive film 212 and the dummy films 214and 216 are spaced apart from each other, in accordance with someembodiments. The conductive film 212 and the dummy films 214 and 216 areelectrically insulated from each other, in accordance with someembodiments.

The conductive layer 210 is thinner than the wiring layer 134, thedielectric layer 132, or the dielectric layer 150, in accordance withsome embodiments. The conductive layer 210 is thicker than thedielectric layer 190, in accordance with some embodiments. Theconductive layer 210 has a thickness T9 ranging from about 100 Å toabout 800 Å, in accordance with some embodiments. The thickness T9ranges from about 200 Å to about 700 Å, in accordance with someembodiments.

The conductive layer 210 is made of a capacitor electrode material, inaccordance with some embodiments. The capacitor electrode materialincludes metal (e.g., copper, aluminum, gold, silver, or tungsten),alloy thereof, nitrides (e.g., titanium nitride), or another suitablecapacitor electrode material, in accordance with some embodiments.

The conductive layer 210 is formed using a deposition process (e.g., aphysical vapor deposition process or a chemical vapor depositionprocess), a photolithography process, an etching process, and anoptional cleaning and passivation process, in accordance with someembodiments. The cleaning and passivation process is used to clean theresidues from the photolithography process and to passivate the surfaceof the conductive layer 210, in accordance with some embodiments. Thecleaning and passivation process includes a plasma process using N₂O orAr as a process gas, in accordance with some embodiments.

As shown in FIG. 1D-1, a dielectric layer 220 is formed over theconductive layer 210 and the dielectric layer 190, in accordance withsome embodiments. The dielectric layer 220 is thinner than the wiringlayer 134 or the dielectric layer 132, in accordance with someembodiments. The dielectric layer 220 has a thickness T10 ranging fromabout 3500 Å to about 5500 Å, in accordance with some embodiments.

The dielectric layer 220 is made of an insulating material, such asoxides (e.g., silicon oxide), nitrides (e.g., silicon nitride or siliconoxynitride), or un-doped silicate glass (USG), in accordance with someembodiments. The dielectric layer 220 is formed using a depositionprocess, such as a chemical vapor deposition process (e.g., a plasmaenhanced chemical vapor deposition process) or a physical vapordeposition process, in accordance with some embodiments.

For the sake of clarity, FIG. 1E-2 omits the dielectric layer 220, inaccordance with some embodiments. As shown in FIGS. 1E-1 and 1E-2,portions of the dielectric layer 220, the conductive layer 210, thedielectric layer 190, the conductive layer 180, the dielectric layer170, the conductive layer 160, the dielectric layer 150, and the etchstop layer 140 are removed to form through holes 232, 234, and 236, inaccordance with some embodiments. The through holes 232, 234, and 236respectively expose the conductive lines 134 c, 134 d, and 134 e, inaccordance with some embodiments.

The through hole 232 passes directly through the dummy films 184 and214, in accordance with some embodiments. The through hole 234 passesdirectly through the dummy film 216 and the conductive film 182, inaccordance with some embodiments. The through hole 236 passes directlythrough the conductive film 212 and the conductive layer 160, inaccordance with some embodiments.

The formation of the dummy films 184, 214, and 216 helps the throughholes 232, 234, and 236 pass directly through the same number (i.e., 2)of conductive layers 160, 180, and 210. Therefore, the removal processfor forming the through holes 232, 234, and 236 may be performeduniformly and over etching of the conductive lines 134 c and 134 d maybe prevented.

The through hole 232 directly and passes indirectly through thedielectric layer 220, the conductive layer 210, the dielectric layer190, the conductive layer 180, the dielectric layer 170, the dielectriclayer 150, and the etch stop layer 140, in accordance with someembodiments.

In some embodiments, the through hole 234 passes indirectly through theconductive layer 160. The through hole 234 directly and passesindirectly through the dielectric layer 220, the conductive layer 210,the dielectric layer 190, the conductive layer 180, the dielectric layer170, the conductive layer 160, the dielectric layer 150, and the etchstop layer 140, in accordance with some embodiments.

The through hole 236 passes indirectly through the conductive film 182of the conductive layer 180, in accordance with some embodiments. Thethrough hole 236 directly and passes indirectly through the dielectriclayer 220, the conductive layer 210, the dielectric layer 190, theconductive layer 180, the dielectric layer 170, the conductive layer160, the dielectric layer 150, and the etch stop layer 140, inaccordance with some embodiments.

For the sake of clarity, FIG. 1F-2 omits the dielectric layer 220, inaccordance with some embodiments. As shown in FIGS. 1F-1 and 1F-2,conductive structures 242, 244 and 246 are respectively formed in andover the through holes 232, 234, and 236, in accordance with someembodiments. Each of the conductive structure 242, 244, or 246 includesa seed layer 241 a and a conductive layer 241 b, in accordance with someembodiments. The conductive layer 241 b is formed over the seed layer241 a, in accordance with some embodiments.

The conductive structure 242 includes a conductive via 242 v and aconductive pad 242 p, in accordance with some embodiments. Theconductive via 242 v is in the through hole 232, in accordance with someembodiments. The conductive via 242 v is electrically connected to theconductive line 134 c, in accordance with some embodiments. Theconductive pad 242 p is over and in direct contact with the conductivevia 242 v, in accordance with some embodiments.

The conductive structure 244 includes a conductive via 244 v and aconductive pad 244 p, in accordance with some embodiments. Theconductive via 244 v is in the through hole 234, in accordance with someembodiments. The conductive via 244 v is electrically connected to theconductive film 182 and the conductive line 134 d, in accordance withsome embodiments. The conductive pad 244 p is over and in direct contactwith the conductive via 244 v, in accordance with some embodiments.

The conductive structure 246 includes a conductive via 246 v and aconductive pad 246 p, in accordance with some embodiments. Theconductive via 246 v is in the through hole 236, in accordance with someembodiments. The conductive via 246 v is electrically connected to theconductive layer 160, the conductive film 212, and the conductive line134 e, in accordance with some embodiments.

The conductive film 212, the dielectric layer 190, and the conductivefilm 182 together form a first capacitor, in accordance with someembodiments. The conductive layer 160, the dielectric layer 170, and theconductive film 182 together form a second capacitor, in accordance withsome embodiments. The first capacitor is electrically connected inparallel with the second capacitor via the conductive structures 244 and246, in accordance with some embodiments.

The conductive pad 246 p is over and in direct contact with theconductive via 246 v, in accordance with some embodiments. Theconductive layer 160, 180 or 210 is thinner than the conductive pad 242p, 244 p or 246 p, in accordance with some embodiments. The conductivepad 242 p, 244 p or 246 p has a thickness T11 ranging from about 5000 Åto about 11000 Å, in accordance with some embodiments.

The seed layer 241 a and the conductive layer 241 b are made of metal(e.g., aluminum, copper, gold, silver, or tungsten) or alloy thereof, inaccordance with some embodiments. The formation of the seed layer 241 aand the conductive layer 241 b includes performing a deposition processto form a seed material layer (not shown); performing a plating processto form a conductive material layer (not shown); and performing aphotolithography process and an etching process, in accordance with someembodiments. The deposition process includes a physical vapor depositionprocess or a chemical vapor deposition process, in accordance with someembodiments. The plating process includes an electroplating process, inaccordance with some embodiments.

As shown in FIG. 1G-1, a dielectric layer 250 is formed over theconductive structures 242, 244 and 246 and the dielectric layer 220, inaccordance with some embodiments. The dielectric layer 250 has openings252, 254, and 256, in accordance with some embodiments. The openings252, 254, and 256 respectively expose the conductive structures 242, 244and 246, in accordance with some embodiments. The dielectric layer 250has a thickness T12 ranging from about 9000 Å to about 15000 Å, inaccordance with some embodiments.

The dielectric layer 250 is made of an insulating material, such asoxides (e.g., silicon oxide), nitrides (e.g., silicon nitride or siliconoxynitride), or un-doped silicate glass (USG), in accordance with someembodiments. The dielectric layer 250 is formed using a depositionprocess, such as a chemical vapor deposition process or a physical vapordeposition process, in accordance with some embodiments.

As shown in FIG. 1G-1, a protective layer 260 is formed over thedielectric layer 250, in accordance with some embodiments. Theprotective layer 260 is used to protect the dielectric layer 250 fromdamage or being affected by moisture, in accordance with someembodiments. The protective layer 260 has openings 262, 264, and 266, inaccordance with some embodiments. The openings 262, 264, and 266respectively expose the conductive structures 242, 244 and 246, inaccordance with some embodiments. The protective layer 260 has athickness T13 ranging from about 3500 Å to about 10000 Å, in accordancewith some embodiments.

The protective layer 260 is made of an insulating material, such asnitrides (e.g., silicon nitride or silicon oxynitride), in accordancewith some embodiments. The protective layer 260 is formed using adeposition process, such as a chemical vapor deposition process or aphysical vapor deposition process, in accordance with some embodiments.

As shown in FIG. 1G-1, a seed layer 272 is formed over the protectivelayer 260, the dielectric layer 250, and the conductive structures 242,244 and 246, in accordance with some embodiments. The seed layer 272 ismade of metal (e.g., copper, aluminum, gold, silver, or tungsten) oralloy thereof, in accordance with some embodiments. The seed layer 272is formed using a deposition process, such as a physical vapordeposition process or a chemical vapor deposition process, in accordancewith some embodiments.

As shown in FIG. 1G-1, a mask layer 280 is formed over the seed layer272, in accordance with some embodiments. The mask layer 280 hasopenings 282, 284, and 286 respectively over the openings 262, 264, and266, in accordance with some embodiments. The openings 282, 284, and 286expose portions of the seed layer 272, in accordance with someembodiments. The mask layer 280 is made of a polymer material, such as aphotoresist material, in accordance with some embodiments.

As shown in FIG. 1G-1, conductive layers 274 are formed over the exposedseed layer 272 and in the openings 282, 284, and 286, in accordance withsome embodiments. The conductive layers 274 are made of metal (e.g.,copper, aluminum, gold, silver, or tungsten) or alloy thereof, inaccordance with some embodiments. The conductive layers 274 are formedusing a plating process, such as an electroplating process, inaccordance with some embodiments.

As shown in FIG. 1G-1, conductive layers 290 a are formed over theconductive layers 274, in accordance with some embodiments. Theconductive layers 290 a are made of a solder material, such as tin, inaccordance with some embodiments. The conductive layers 290 a are formedusing a plating process, such as an electroplating process, inaccordance with some embodiments.

As shown in FIGS. 1G-1 and 1H-1, the mask layer 280 and the seed layer272 under the mask layer 280 are removed, in accordance with someembodiments. After the removal process, each conductive layer 274 andthe seed layer 272 thereunder together form a bump structure 270, inaccordance with some embodiments. The bump structure 270 is over and indirect contact with the conductive structure 242, 244 or 246, inaccordance with some embodiments. As shown in FIG. 1H-1, a reflowprocess is performed over the conductive layer 290 a to form solderballs 290, in accordance with some embodiments. In this step, a chipstructure 100 is substantially formed, in accordance with someembodiments.

The width W1 of the conductive via 242 v, 244 v or 246 v is greater thanthe width W2 of the conductive via 126 of the interconnect structure120, in accordance with some embodiments. The width W1 ranges fromabout?? Å to about?? Å, in accordance with some embodiments. The widthW2 ranges from about?? A to about?? A, in accordance with someembodiments. (Note to TSMC inventor: Please provide possible range ofthe widths W1 and W2, thank you!)

Since the first capacitor and the second capacitor are integrated intothe chip structure 100, the conductive path between the device elements,which are formed at the surface 112 of the substrate 110, and the firstand second capacitors is greatly reduced, in accordance with someembodiments. Therefore, the resistance of aforementioned conductive pathis greatly reduced, in accordance with some embodiments.

Furthermore, since the conductive via 242 v, 244 v or 246 v is widerthan the conductive via 126 of the interconnect structure 120, thecontact area between the conductive via 242 v, 244 v or 246 v and thefirst and second capacitors is larger than the contact area between theconductive via 126 and a capacitor (not shown) formed in theinterconnect structure 120. Therefore, the charging speed of the firstand second capacitors is improved, and the operation frequency of thefirst and second capacitors is improved as well, in accordance with someembodiments.

FIG. 2A is a cross-sectional view of a chip structure 200, in accordancewith some embodiments. FIG. 2B is a top view of the chip structure 200of FIG. 2A, in accordance with some embodiments. As shown in FIGS. 2Aand 2B, the chip structure 200 is similar to the chip structure 100 ofFIG. 1H-1, except that the conductive layer 160 of the chip structure200 further has a dummy film 164, and the conductive layer 210 of thechip structure 200 does not have the dummy film 216, in accordance withsome embodiments.

The dummy film 164 is in the opening 162 of the conductive layer 160, inaccordance with some embodiments. The conductive structure 244 passesdirectly through the dummy film 164 of the conductive layer 160 and theconductive film 182 of the conductive layer 180, in accordance with someembodiments.

FIG. 3A-1 to FIG. 3F-1 are cross-sectional views of various stages of aprocess for forming a chip structure, in accordance with someembodiments. FIG. 3A-2 to FIG. 3E-2 are top views illustrating the chipstructure in FIG. 3A-1 to FIG. 3E-1, in accordance with someembodiments.

As shown in FIGS. 3A-1 and 3A-2, a step similar to the step of FIG. 1A-1is performed to form a substrate 110, an interconnect structure 120, adielectric layer 132, a wiring layer 134, an etch stop layer 140, adielectric layer 150, and a conductive layer 310, in accordance withsome embodiments.

The step of FIGS. 3A-1 and 3A-2 is similar to that of the FIGS. 1A-1 and1A-2, except that in comparison with the conductive layer 160 formed inthe step of FIGS. 1A-1 and 1A-2, the conductive layer 310 formed in thestep of FIGS. 3A-1 and 3A-2 includes a conductive line 312, and theconductive line 312 has a spiral shape, in accordance with someembodiments. The conductive layer 310 is used as an inductor, inaccordance with some embodiments.

The conductive line 312 has end portions 312 a and 312 b and a mainportion 312 c, in accordance with some embodiments. The end portions 312a and 312 b are connected to the main portion 312 c, in accordance withsome embodiments. The end portion 312 a or 312 b is wider than the mainportion 312 c, in accordance with some embodiments. That is, a linewidth W3 of the end portion 312 a or 312 b is greater than a line widthW4 of the main portion 312 c, in accordance with some embodiments.

The conductive line 312 may have a round spiral shape (as shown in FIG.3A-2), a square spiral shape (as shown in FIG. 4), a hexagonal spiralshape (as shown in FIG. 5), or an octagonal spiral shape (as shown inFIG. 6), in accordance with some embodiments.

The conductive layer 310 is made of an inductor material, in accordancewith some embodiments. The inductor material includes metal (e.g.,copper, aluminum, gold, silver, or tungsten), alloy thereof, nitrides(e.g., titanium nitride), or another suitable inductor material, inaccordance with some embodiments.

As shown in FIGS. 3B-1 and 3B-2, a dielectric layer 320 is formed overthe conductive layer 310 and the dielectric layer 150, in accordancewith some embodiments. The dielectric layer 320 conformally covers theconductive layer 310, in accordance with some embodiments. In someembodiments, the dielectric layer 320 is a single-layered structure. Insome other embodiments, the dielectric layer 320 is a multi-layeredstructure. The multi-layered structure has layers, and each layer ismade of a material different from that of adjacent layer(s), inaccordance with some embodiments.

The dielectric layer 320 is made of an insulating material, such asoxides (e.g., silicon oxide), nitrides (e.g., silicon nitride or siliconoxynitride), silicon carbide, un-doped silicate glass (USG), or a low-kdielectric material with a k-value lower than that of silicon oxide, inaccordance with some embodiments. The dielectric layer 320 is formedusing a deposition process, such as a chemical vapor deposition (CVD)process, a thermal atomic layer deposition (ALD) process, a plasmaenhanced atomic layer deposition (PEALD) process, or another suitabledeposition process.

As shown in FIGS. 3B-1 and 3B-2, a conductive layer 330 is formed overthe dielectric layer 320, in accordance with some embodiments. Theconductive layer 330 includes a conductive line 332, and the conductiveline 332 has a spiral shape, in accordance with some embodiments. Theconductive layer 330 is used as an inductor, in accordance with someembodiments.

The conductive line 332 has end portions 332 a and 332 b and a mainportion 332 c, in accordance with some embodiments. The end portions 332a and 332 b are connected to the main portion 332 c, in accordance withsome embodiments. The end portion 332 a or 332 b is wider than the mainportion 332 c, in accordance with some embodiments. That is, a linewidth W5 of the end portion 332 a or 332 b is greater than a line widthW6 of the main portion 332 c, in accordance with some embodiments.

The conductive line 332 may have a round spiral shape (as shown in FIG.3B-2), a square spiral shape (which is similar to that of the conductiveline 312 of FIG. 4), a hexagonal spiral shape (which is similar to thatof the conductive line 312 of FIG. 5), or an octagonal spiral shape(which is similar to that of the conductive line 312 of FIG. 6), inaccordance with some embodiments.

The conductive layer 330 is made of an inductor material, in accordancewith some embodiments. The inductor material includes metal (e.g.,copper, aluminum, gold, silver, or tungsten), alloy thereof, nitrides(e.g., titanium nitride), or another suitable inductor material, inaccordance with some embodiments.

As shown in FIGS. 3C-1 and 3C-2, a dielectric layer 340 is formed overthe conductive layer 330 and the dielectric layer 320, in accordancewith some embodiments. The dielectric layer 340 conformally covers theconductive layer 330 and the dielectric layer 320, in accordance withsome embodiments.

In some embodiments, the dielectric layer 340 is a single-layeredstructure. In some other embodiments, the dielectric layer 340 is amulti-layered structure. The multi-layered structure has layers, andeach layer is made of a material different from that of adjacentlayer(s), in accordance with some embodiments.

The dielectric layer 340 is made of an insulating material, such asoxides (e.g., silicon oxide), nitrides (e.g., silicon nitride or siliconoxynitride), silicon carbide, un-doped silicate glass (USG), or a low-kdielectric material with a k-value lower than that of silicon oxide, inaccordance with some embodiments.

The dielectric layer 340 is formed using a deposition process, such as achemical vapor deposition (CVD) process, a thermal atomic layerdeposition (ALD) process, a plasma enhanced atomic layer deposition(PEALD) process, or another suitable deposition process.

As shown in FIGS. 3C-1 and 3C-2, a conductive layer 350 is formed overthe dielectric layer 340, in accordance with some embodiments. Theconductive layer 350 includes a conductive line 352, and the conductiveline 352 has a spiral shape, in accordance with some embodiments. Theconductive layer 350 is used as an inductor, in accordance with someembodiments.

The conductive line 352 has end portions 352 a and 352 b and a mainportion 352 c, in accordance with some embodiments. The end portions 352a and 352 b are connected to the main portion 352 c, in accordance withsome embodiments. The end portion 352 a or 352 b is wider than the mainportion 352 c, in accordance with some embodiments. That is, a linewidth W7 of the end portion 352 a or 352 b is greater than a line widthW8 of the main portion 352 c, in accordance with some embodiments.

The conductive line 352 may have a round spiral shape (as shown in FIG.3C-2), a square spiral shape (which is similar to that of the conductiveline 312 of FIG. 4), a hexagonal spiral shape (which is similar to thatof the conductive line 312 of FIG. 5), or an octagonal spiral shape(which is similar to that of the conductive line 312 of FIG. 6), inaccordance with some embodiments.

The conductive layer 350 is made of an inductor material, in accordancewith some embodiments. The inductor material includes metal (e.g.,copper, aluminum, gold, silver, or tungsten), alloy thereof, nitrides(e.g., titanium nitride), or another suitable inductor material, inaccordance with some embodiments.

As shown in FIG. 3D-1, the step of FIG. 1D-1 is performed to form adielectric layer 220 over the conductive layer 350 and the dielectriclayer 340, in accordance with some embodiments. The dielectric layer 220covers the entire conductive layer 350 and the entire dielectric layer340, in accordance with some embodiments. For the sake of clarity, FIG.3D-2 omits the dielectric layer 220, in accordance with someembodiments.

As shown in FIGS. 3D-1 and 3D-2, portions of the dielectric layer 220,the conductive layer 350, the dielectric layer 340, the conductive layer330, the dielectric layer 320, the conductive layer 310, the dielectriclayer 150, and the etch stop layer 140 are removed to form through holes362 and 364, in accordance with some embodiments. The through holes 362and 364 respectively expose the conductive lines 134 c and 134 d, inaccordance with some embodiments.

The through hole 362 passes through the end portions 312 a, 332 a, and352 a, in accordance with some embodiments. The through hole 364 passesthrough the end portions 312 b, 332 b, and 352 b, in accordance withsome embodiments. The through holes 362 and 364 are formed using aphotolithography process and an etching process, in accordance with someembodiments.

For the sake of clarity, FIG. 3E-2 omits the dielectric layer 220, inaccordance with some embodiments. As shown in FIGS. 3E-1 and 3E-2, thestep of FIG. 1F-1 is performed to form conductive structures 242 and244, in accordance with some embodiments.

The conductive structures 242 and 244 are respectively formed in andover the through holes 362 and 364, in accordance with some embodiments.Each of the conductive structure 242 or 244 includes a seed layer 241 aand a conductive layer 241 b, in accordance with some embodiments. Theconductive layer 241 b is formed over the seed layer 241 a, inaccordance with some embodiments.

The conductive structure 242 includes a conductive via 242 v and aconductive pad 242 p, in accordance with some embodiments. Theconductive via 242 v is in the through hole 362, in accordance with someembodiments. The conductive via 242 v passes through the end portions312 a, 332 a, and 352 a, in accordance with some embodiments. Theconductive via 242 v is electrically connected to the conductive layers310, 330, and 350, in accordance with some embodiments. The conductivepad 242 p is over and in direct contact with the conductive via 242 v,in accordance with some embodiments.

The conductive structure 244 includes a conductive via 244 v and aconductive pad 244 p, in accordance with some embodiments. Theconductive via 244 v is in the through hole 364, in accordance with someembodiments. The conductive via 244 v passes through the end portions312 b, 332 b, and 352 b, in accordance with some embodiments.

The conductive via 244 v is electrically connected to the conductivelayers 310, 330, and 350, in accordance with some embodiments. Theconductive pad 244 p is over and in direct contact with the conductivevia 244 v, in accordance with some embodiments.

In some embodiments, the conductive layer 310 is a first inductor, theconductive layer 330 is a second inductor, and the conductive layer 350is a third inductor. The first inductor, the second inductor and thethird inductor are electrically connected in parallel with each othervia the conductive structures 242 and 244, in accordance with someembodiments.

As shown in FIG. 3F-1, the steps of FIGS. 1G-1 and 1H-1 are performed toform a dielectric layer 250, a protective layer 260, bump structures270, and solder balls 290, in accordance with some embodiments. Thedielectric layer 250 is formed over the conductive structures 242 and244 and the dielectric layer 220, in accordance with some embodiments.The dielectric layer 250 has openings 252 and 254, in accordance withsome embodiments. The openings 252 and 254 respectively expose theconductive structures 242 and 244, in accordance with some embodiments.

The protective layer 260 is formed over the dielectric layer 250, inaccordance with some embodiments. The protective layer 260 is used toprotect the dielectric layer 250 from damage or being affected bymoisture, in accordance with some embodiments. The protective layer 260has openings 262 and 264, in accordance with some embodiments. Theopenings 262 and 264 respectively expose the conductive structures 242and 244, in accordance with some embodiments.

The bump structures 270 are respectively in the openings 262 and 264, inaccordance with some embodiments. Each bump structure 270 includes aseed layer 272 and a conductive layer 274, in accordance with someembodiments. The conductive layer 274 is over the seed layer 272, inaccordance with some embodiments. The solder balls 290 are respectivelyover the bump structures 270, in accordance with some embodiments. Inthis step, a chip structure 300 is substantially formed, in accordancewith some embodiments. The width W1 of the conductive via 242 v or 244 vis greater than the width W2 of the conductive via 126 of theinterconnect structure 120, in accordance with some embodiments.

Since the first inductor, the second inductor, and the third inductorare integrated into the chip structure 300, the conductive path betweenthe device elements, which are formed at the surface 112 of thesubstrate 110, and the first, second and third inductors is greatlyreduced, in accordance with some embodiments. Therefore, the resistanceof aforementioned conductive path is greatly reduced, in accordance withsome embodiments.

Furthermore, since the conductive via 242 v or 244 v is wider than theconductive via 126 of the interconnect structure 120, the contact areabetween the conductive via 242 v or 244 v and the first, second andthird inductors is larger than the contact area between the conductivevia 126 and an inductor (not shown) formed in the interconnect structure120. Therefore, the resistance between the conductive via 242 v or 244 vand the first, second and third inductors is reduced, in accordance withsome embodiments.

FIG. 7A-1 to FIG. 7F-1 are top views of various stages of a process forforming a chip structure, in accordance with some embodiments. FIG. 7A-2to FIG. 7F-2 are cross-sectional views illustrating the chip structurealong a sectional line I-I in FIG. 7A-1 to FIG. 7F-1, in accordance withsome embodiments. FIG. 7A-3 to FIG. 7F-3 are cross-sectional viewsillustrating the chip structure along a sectional line II-II in FIG.7A-1 to FIG. 7F-1, in accordance with some embodiments.

As shown in FIGS. 7A-1, 7A-2, and 7A-3, a step similar to the step ofFIG. 1A-1 is performed to form a substrate 110, an interconnectstructure 120, a dielectric layer 132, a wiring layer 134, an etch stoplayer 140, a dielectric layer 150, and a conductive layer 710, inaccordance with some embodiments. The wiring layer 134 includesconductive lines 134 c, 134 d, 134 e, and 134 f, in accordance with someembodiments.

The step of FIGS. 7A-1, 7A-2, and 7A-3 is similar to the FIGS. 1A-1 and1A-2, except that in comparison with the conductive layer 160 formed inthe step of FIGS. 1A-1 and 1A-2, the conductive layer 710 formed in thestep of FIGS. 7A-1, 7A-2, and 7A-3 includes a conductive line 712, inaccordance with some embodiments. The conductive line 712 has a wavyshape (or a meander shape), in accordance with some embodiments. Theconductive line 712 is used as a resistor, in accordance with someembodiments.

The conductive line 712 has end portions 712 a and 712 b and a mainportion 712 c, in accordance with some embodiments. The end portions 712a and 712 b are connected to the main portion 712 c, in accordance withsome embodiments. The end portion 712 a or 712 b is wider than the mainportion 712 c, in accordance with some embodiments. That is, a linewidth W9 of the end portion 712 a or 712 b is greater than a line widthW10 of the main portion 712 c, in accordance with some embodiments.

The conductive layer 710 is made of a resistor material, in accordancewith some embodiments. The resistor material includes semiconductor(e.g., polysilicon), nitrides (e.g., titanium nitride), metal (e.g.,tantalum), alloy (e.g., nichrome) or another suitable resistor material,in accordance with some embodiments. In some embodiments, the resistanceof the resistor material is higher than that of the materials of thewiring layers 124 and 134 or the conductive vias 126.

In some other embodiments, the conductive layer 710 and the wiringlayers 124 and 134 (or the conductive vias 126) are made of the samematerial (e.g., copper, aluminum, gold, silver, tungsten, alloysthereof), and the resistance of the conductive layer 710 may be adjustedby adjusting the shape or the size (e.g., the length) of the conductiveline 712, in accordance with some embodiments.

As shown in FIGS. 7B-1, 7B-2, and 7B-3, a dielectric layer 720 is formedover the conductive layer 710 and the dielectric layer 150, inaccordance with some embodiments. The dielectric layer 720 covers theentire conductive layer 710 and the entire dielectric layer 150, inaccordance with some embodiments.

The dielectric layer 720 conformally covers the conductive layer 710 andthe dielectric layer 150, in accordance with some embodiments. In someembodiments, the dielectric layer 720 is a single-layered structure. Insome other embodiments, the dielectric layer 720 is a multi-layeredstructure. The multi-layered structure has layers, and each layer ismade of a material different from that of adjacent layer(s), inaccordance with some embodiments.

The dielectric layer 720 is made of an insulating material, such asoxides (e.g., silicon oxide), nitrides (e.g., silicon nitride or siliconoxynitride), silicon carbide, un-doped silicate glass (USG), or a low-kdielectric material with a k-value lower than that of silicon oxide, inaccordance with some embodiments.

The dielectric layer 720 is formed using a deposition process, such as achemical vapor deposition (CVD) process, a thermal atomic layerdeposition (ALD) process, a plasma enhanced atomic layer deposition(PEALD) process, or another suitable deposition process.

As shown in FIGS. 7B-1, 7B-2, and 7B-3, a conductive layer 730 is formedover the dielectric layer 720, in accordance with some embodiments. Theconductive layer 730 includes a conductive line 732 and dummy films 734and 736, in accordance with some embodiments. The conductive line 732has a wavy shape (or a meander shape), in accordance with someembodiments. The conductive line 732 is used as a resistor, inaccordance with some embodiments.

The conductive line 732 has end portions 732 a and 732 b and a mainportion 732 c, in accordance with some embodiments. The end portions 732a and 732 b are connected to the main portion 732 c, in accordance withsome embodiments. The end portion 732 a or 732 b is wider than the mainportion 732 c, in accordance with some embodiments. That is, a linewidth W11 of the end portion 732 a or 732 b is greater than a line widthW12 of the main portion 732 c, in accordance with some embodiments. Thedummy film 734 overlaps the end portion 712 a, in accordance with someembodiments. The end portion 732 b overlaps the end portion 712 b, inaccordance with some embodiments.

The conductive layer 730 is made of a resistor material, in accordancewith some embodiments. The resistor material includes semiconductor(e.g., polysilicon), nitrides (e.g., titanium nitride), metal (e.g.,tantalum), alloy (e.g., nichrome), or another suitable resistormaterial, in accordance with some embodiments. In some embodiments, theresistance of the resistor material is higher than that of the materialsof the wiring layers 124 and 134 or the conductive vias 126.

In some other embodiments, the conductive layer 730 and the wiringlayers 124 and 134 (or the conductive vias 126) are made of the samematerial (e.g., copper, aluminum, gold, silver, tungsten, alloysthereof), and the resistance of the conductive layer 730 may be adjustedby adjusting the shape or the size (e.g., the length) of the conductiveline 732, in accordance with some embodiments.

As shown in FIGS. 7C-1, 7C-2, and 7C-3, a dielectric layer 740 is formedover the conductive layer 730 and the dielectric layer 720, inaccordance with some embodiments. The dielectric layer 740 covers theentire conductive layer 730 and the entire dielectric layer 720, inaccordance with some embodiments.

The dielectric layer 740 conformally covers the conductive layer 730 andthe dielectric layer 720, in accordance with some embodiments. In someembodiments, the dielectric layer 740 is a single-layered structure. Insome other embodiments, the dielectric layer 740 is a multi-layeredstructure. The multi-layered structure has layers, and each layer ismade of a material different from that of adjacent layer(s), inaccordance with some embodiments.

The dielectric layer 740 is made of an insulating material, such asoxides (e.g., silicon oxide), nitrides (e.g., silicon nitride or siliconoxynitride), silicon carbide, un-doped silicate glass (USG), or a low-kdielectric material with a k-value lower than that of silicon oxide, inaccordance with some embodiments. The dielectric layer 740 is formedusing a deposition process, such as a chemical vapor deposition (CVD)process, a thermal atomic layer deposition (ALD) process, a plasmaenhanced atomic layer deposition (PEALD) process, or another suitabledeposition process.

As shown in FIGS. 7C-1, 7C-2, and 7C-3, a conductive layer 750 is formedover the dielectric layer 740, in accordance with some embodiments. Theconductive layer 750 includes a conductive line 752, in accordance withsome embodiments. The conductive line 752 has a wavy shape (or a meandershape), in accordance with some embodiments. The conductive line 752 isused as a resistor, in accordance with some embodiments.

The conductive line 752 has end portions 752 a and 752 b and a mainportion 752 c, in accordance with some embodiments. The end portions 752a and 752 b are connected to the main portion 752 c, in accordance withsome embodiments. The end portion 752 a or 752 b is wider than the mainportion 752 c, in accordance with some embodiments. That is, a linewidth W13 of the end portion 752 a or 752 b is greater than a line widthW14 of the main portion 752 c, in accordance with some embodiments.

The conductive layer 750 is made of a resistor material, in accordancewith some embodiments. The resistor material includes semiconductor(e.g., polysilicon), nitrides (e.g., titanium nitride), metal (e.g.,tantalum), alloy (e.g., nichrome), or another suitable resistormaterial, in accordance with some embodiments. In some embodiments, theresistance of the resistor material is higher than that of the materialsof the wiring layers 124 and 134 or the conductive vias 126.

In some other embodiments, the conductive layer 750 and the wiringlayers 124 and 134 (or the conductive vias 126) are made of the samematerial (e.g., copper, aluminum, gold, silver, tungsten, alloysthereof), and the resistance of the conductive layer 750 may be adjustedby adjusting the shape or the size (e.g., the length) of the conductiveline 752, in accordance with some embodiments.

As shown in FIGS. 7D-1, 7D-2, and 7D-3, the step of FIG. 1D-1 isperformed to form a dielectric layer 220 over the conductive layer 750and the dielectric layer 740, in accordance with some embodiments. Forthe sake of clarity, FIG. 7D-1 omits the dielectric layer 220, inaccordance with some embodiments.

As shown in FIGS. 7D-1, 7D-2 and 7D-3, portions of the dielectric layer220, the conductive layer 750, the dielectric layer 740, the conductivelayer 730, the dielectric layer 720, the conductive layer 710, thedielectric layer 150, and the etch stop layer 140 are removed to formthrough holes 762, 764, 766 and 768, in accordance with someembodiments. The through holes 762, 764, 766 and 768 respectively exposethe conductive lines 134 c, 134 d, 134 e and 134 f, in accordance withsome embodiments.

The through hole 762 passes through the end portion 712 a and the dummyfilm 734, in accordance with some embodiments. The through hole 764passes through the end portions 732 a and 752 a, in accordance with someembodiments. The through hole 766 passes through the end portions 712 band 732 b, in accordance with some embodiments.

The through hole 768 passes through the end portion 752 b and the dummyfilm 736, in accordance with some embodiments. The through holes 762,764, 766 and 768 are formed using a photolithography process and anetching process, in accordance with some embodiments.

For the sake of clarity, FIG. 7E-1 omits the dielectric layer 220, inaccordance with some embodiments. As shown in FIGS. 7E-1, 7E-2, and7E-3, the step of FIG. 1F-1 is performed to form conductive structures242, 244, 246 and 248, in accordance with some embodiments.

The conductive structures 242, 244, 246 and 248 are respectively formedin and over the through holes 762, 764, 766 and 768, in accordance withsome embodiments. Each of the conductive structure 242, 244, 246 or 248includes a seed layer 241 a and a conductive layer 241 b, in accordancewith some embodiments. The conductive layer 241 b is formed over theseed layer 241 a, in accordance with some embodiments.

The conductive structure 242 includes a conductive via 242 v and aconductive pad 242 p, in accordance with some embodiments. Theconductive via 242 v is in the through hole 762, in accordance with someembodiments. The conductive via 242 v passes through the end portion 712a and the dummy film 734, in accordance with some embodiments. Theconductive via 242 v is electrically connected to the conductive line712, in accordance with some embodiments. The conductive pad 242 p isover and in direct contact with the conductive via 242 v, in accordancewith some embodiments.

The conductive structure 244 includes a conductive via 244 v and aconductive pad 244 p, in accordance with some embodiments. Theconductive via 244 v is in the through hole 764, in accordance with someembodiments. The conductive via 244 v passes through the end portions732 a and 752 a, in accordance with some embodiments. The conductive via244 v is electrically connected to the conductive lines 732 and 752, inaccordance with some embodiments. The conductive pad 244 p is over andin direct contact with the conductive via 244 v, in accordance with someembodiments.

The conductive structure 246 includes a conductive via 246 v and aconductive pad 246 p, in accordance with some embodiments. Theconductive via 246 v is in the through hole 766, in accordance with someembodiments. The conductive via 246 v passes through the end portions712 b and 732 b, in accordance with some embodiments. The conductive via246 v is electrically connected to the conductive lines 712 and 732, inaccordance with some embodiments. The conductive pad 246 p is over andin direct contact with the conductive via 246 v, in accordance with someembodiments.

The conductive structure 248 includes a conductive via 248 v and aconductive pad 248 p, in accordance with some embodiments. Theconductive via 248 v is in the through hole 768, in accordance with someembodiments. The conductive via 248 v passes through the end portion 752b and the dummy film 736, in accordance with some embodiments. Theconductive via 248 v is electrically connected to the conductive line752, in accordance with some embodiments. The conductive pad 248 p isover and in direct contact with the conductive via 248 v, in accordancewith some embodiments.

In some embodiments, the conductive line 712 is a first resistor, theconductive line 732 is a second resistor, and the conductive line 752 isa third resistor. The first resistor, the second resistor and the thirdresistor are electrically connected in series with each other via theconductive structures 242, 244, 246 and 248, in accordance with someembodiments.

In some embodiments, a current flows from the conductive structure 242to the conductive structure 248 sequentially through the conductive line712 (including the end portion 712 a, the main portion 712 c, and theend portion 712 b), the conductive structure 246, the conductive line732 (including the end portion 732 b, the main portion 732 c, and theend portion 732 a), the conductive structure 244, and the conductiveline 752 (including the end portion 752 a, the main portion 752 c, andthe end portion 752 b), in accordance with some embodiments.

As shown in FIGS. 7F-1, 7F-2, and 7F-3, the steps of FIGS. 1G-1 and 1H-1are performed to form a dielectric layer 250, a protective layer 260,bump structures 270, and solder balls 290, in accordance with someembodiments. The dielectric layer 250 is formed over the conductivestructures 242, 244, 246 and 248 and the dielectric layer 220, inaccordance with some embodiments. The dielectric layer 250 has openings252, 254, 256 and 258, in accordance with some embodiments. The openings252, 254, 256 and 258 respectively expose the conductive structures 242,244, 246 and 248, in accordance with some embodiments.

The protective layer 260 is formed over the dielectric layer 250, inaccordance with some embodiments. The protective layer 260 is used toprotect the dielectric layer 250 from damage or being affected bymoisture, in accordance with some embodiments. The protective layer 260has openings 262, 264, 266 and 268, in accordance with some embodiments.The openings 262, 264, 266 and 268 respectively expose the conductivestructures 242, 244, 246 and 248, in accordance with some embodiments.

The bump structures 270 are respectively formed in the openings 262,264, 266 and 268, in accordance with some embodiments. Each bumpstructure 270 includes a seed layer 272 and a conductive layer 274, inaccordance with some embodiments. The conductive layer 274 is over theseed layer 272, in accordance with some embodiments. The solder balls290 are respectively over the bump structures 270, in accordance withsome embodiments. In this step, a chip structure 700 is substantiallyformed, in accordance with some embodiments.

Since the first resistor, the second resistor, and the third resistorare integrated into the chip structure 700, the conductive path betweenthe device elements, which are formed at the surface 112 of thesubstrate 110, and the first, second and third resistors may beprecisely controlled which may prevent undesired resistance, inaccordance with some embodiments. Therefore, the performance of the chipstructure 700 is improved, in accordance with some embodiments.

The thickness of the conductive layer 310, 330, 350, 710, 730 or 750 (asshown in FIGS. 3F-1 and 7F-2) is substantially similar to or the same asthat of the conductive layer 160 (as shown in FIG. 1H-1), in accordancewith some embodiments. The thickness of the dielectric layer 320, 340,720 or 740 (as shown in FIGS. 3F-1 and 7F-2) is substantially similar toor the same as that of the dielectric layer 170 or 190 (as shown in FIG.1H-1), in accordance with some embodiments.

Processes and materials for forming the chip structures 200, 300 and 700may be similar to, or the same as, those for forming the chip structure100 described above.

In accordance with some embodiments, chip structures and methods forforming the same are provided. The methods (for forming the chipstructure) form a passive device between a conductive pad and a topmetal layer of a chip structure, in accordance with some embodiments.The passive device is electrically connected to a conductive via betweenthe conductive pad and the top metal layer, in accordance with someembodiments. Since the passive device is integrated into the chipstructure, the conductive path between the passive device and deviceelements formed in the chip structure is reduced, which reduces theresistance of the conductive path. Therefore, the performance of thechip structure is improved.

In accordance with some embodiments, a method for forming a chipstructure is provided. The method includes providing a semiconductorsubstrate, a first conductive line, and a first dielectric layer. Thefirst conductive line is over the semiconductor substrate, and the firstdielectric layer is over the first conductive line and the semiconductorsubstrate. The method includes forming a first conductive layer over thefirst dielectric layer. The first conductive layer is thinner than thefirst conductive line. The method includes forming a second conductivelayer over the first conductive layer. The first conductive layer andthe second conductive layer are electrically insulated from each other.The method includes forming a second dielectric layer over the secondconductive layer and the first conductive layer. The method includesforming a first through hole passing through the second dielectriclayer, the first conductive layer, and the first dielectric layer. Themethod includes forming a first conductive structure in and over thefirst through hole. The first conductive structure includes a firstconductive via and a first conductive pad, the first conductive via isin the first through hole and electrically connected to the firstconductive layer and the first conductive line, and the first conductivepad is over and in direct contact with the first conductive via.

In accordance with some embodiments, a method for forming a chipstructure is provided. The method includes providing a semiconductorsubstrate, a first conductive line, and a first dielectric layer. Thefirst conductive line is over the semiconductor substrate, and the firstdielectric layer is over the first conductive line and the semiconductorsubstrate. The method includes forming a second conductive line over thefirst dielectric layer. The second conductive line is thinner than thefirst conductive line, and the second conductive line has a spiralshape. The method includes forming a second dielectric layer over thesecond conductive line and the first dielectric layer. The methodincludes forming a first through hole passing through the seconddielectric layer, the second conductive line, and the first dielectriclayer. The method includes forming a first conductive structure in andover the first through hole. The first conductive structure includes afirst conductive via and a first conductive pad, the first conductivevia is in the first through hole and electrically connected to thesecond conductive line and the first conductive line, and the firstconductive pad is over and connected to the first conductive via.

In accordance with some embodiments, a method for forming a chipstructure is provided. The method includes providing a semiconductorsubstrate, a first conductive line, and a first dielectric layer. Thefirst conductive line is over the semiconductor substrate, and the firstdielectric layer is over the first conductive line and the semiconductorsubstrate. The method includes forming a conductive layer over the firstdielectric layer. The method includes forming a second dielectric layerover the conductive layer and the first dielectric layer. The methodincludes forming a first through hole passing through the seconddielectric layer, the conductive layer, and the first dielectric layer.The method includes forming a first conductive structure in and over thefirst through hole. The first conductive structure includes a firstconductive via and a first conductive pad, the first conductive via isin the first through hole and electrically connected to the conductivelayer and the first conductive line, the first conductive pad is overthe first conductive via, the conductive layer is made of a firstmaterial having a first resistance, and the first resistance is higherthan a second resistance of a second material of the first conductivestructure.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method for forming a chip structure,comprising: providing a semiconductor substrate, a first conductiveline, and a first dielectric layer, wherein the first conductive line isover the semiconductor substrate, and the first dielectric layer is overthe first conductive line and the semiconductor substrate; forming afirst conductive layer over the first dielectric layer, wherein thefirst conductive layer is thinner than the first conductive line;forming a second conductive layer over the first conductive layer,wherein the first conductive layer and the second conductive layer areelectrically insulated from each other; forming a second dielectriclayer over the second conductive layer and the first conductive layer;forming a first through hole passing through the second dielectriclayer, the first conductive layer, and the first dielectric layer; andforming a first conductive structure in and over the first through hole,wherein the first conductive structure comprises a first conductive viaand a first conductive pad, the first conductive via is in the firstthrough hole and electrically connected to the first conductive layerand the first conductive line, and the first conductive pad is over andin direct contact with the first conductive via.
 2. The method forforming the chip structure as claimed in claim 1, further comprising:forming a third dielectric layer over the first conductive layer beforeforming the second conductive layer over the first conductive layer,wherein the second conductive layer is formed over the third dielectriclayer.
 3. The method for forming the chip structure as claimed in claim2, further comprising: forming a second through hole passing through thesecond dielectric layer, the second conductive layer, the thirddielectric layer, and the first dielectric layer during forming thefirst through hole passing through the second dielectric layer, thefirst conductive layer, and the first dielectric layer.
 4. The methodfor forming the chip structure as claimed in claim 3, furthercomprising: forming a second conductive structure in and over the secondthrough hole, wherein the second conductive structure comprises a secondconductive via and a second conductive pad, the second conductive via isin the second through hole and electrically connected to the secondconductive layer, and the second conductive pad is over and in directcontact with the second conductive via.
 5. The method for forming thechip structure as claimed in claim 2, wherein the third dielectric layerconformally covers the first conductive layer and the first dielectriclayer.
 6. The method for forming the chip structure as claimed in claim2, further comprising: forming a third conductive layer over the secondconductive layer before forming the second dielectric layer over thesecond conductive layer and the first conductive layer, wherein thethird conductive layer and the second conductive layer are electricallyinsulated from each other, and the first conductive structure passesthrough the third conductive layer.
 7. The method for forming the chipstructure as claimed in claim 6, further comprising: forming a fourthdielectric layer over the second conductive layer and the thirddielectric layer before forming the third conductive layer over thesecond conductive layer, wherein the third conductive layer is formedover the fourth dielectric layer.
 8. The method for forming the chipstructure as claimed in claim 7, wherein the fourth dielectric layerconformally covers the second conductive layer and the third dielectriclayer.
 9. The method for forming the chip structure as claimed in claim8, wherein the fourth dielectric layer is in direct contact with thesecond conductive layer and the third dielectric layer.
 10. The methodfor forming the chip structure as claimed in claim 1, wherein the secondconductive layer is thinner than the first conductive line.
 11. A methodfor forming a chip structure, comprising: providing a semiconductorsubstrate, a first conductive line, and a first dielectric layer,wherein the first conductive line is over the semiconductor substrate,and the first dielectric layer is over the first conductive line and thesemiconductor substrate; forming a second conductive line over the firstdielectric layer, wherein the second conductive line is thinner than thefirst conductive line, and the second conductive line has a spiralshape; forming a second dielectric layer over the second conductive lineand the first dielectric layer; forming a first through hole passingthrough the second dielectric layer, the second conductive line, and thefirst dielectric layer; and forming a first conductive structure in andover the first through hole, wherein the first conductive structurecomprises a first conductive via and a first conductive pad, the firstconductive via is in the first through hole and electrically connectedto the second conductive line and the first conductive line, and thefirst conductive pad is over and connected to the first conductive via.12. The method for forming the chip structure as claimed in claim 11,wherein the first conductive pad is thicker than the second conductiveline.
 13. The method for forming the chip structure as claimed in claim11, wherein the second conductive line has a first enlarged end portionand a second enlarged end portion, and the first conductive via passesthrough the first enlarged end portion.
 14. The method for forming thechip structure as claimed in claim 13, further comprising: forming asecond through hole passing through the second dielectric layer, thesecond enlarged end portion, and the first dielectric layer duringforming the first through hole passing through the second dielectriclayer, the second conductive line, and the first dielectric layer; andforming a second conductive structure in and over the second throughhole, wherein the second conductive structure comprises a secondconductive via and a second conductive pad, the second conductive via isin the second through hole and electrically connected to the secondconductive line, and the second conductive pad is over the secondconductive via.
 15. The method for forming the chip structure as claimedin claim 11, further comprising: forming a third dielectric layer overthe second conductive line and the first dielectric layer before formingthe second dielectric layer over the second conductive line and thefirst dielectric layer; and forming a third conductive line over thethird dielectric layer and overlapping the second conductive line,wherein the second dielectric layer is over the third conductive lineand the third dielectric layer.
 16. A method for forming a chipstructure, comprising: providing a semiconductor substrate, a firstconductive line, and a first dielectric layer, wherein the firstconductive line is over the semiconductor substrate, and the firstdielectric layer is over the first conductive line and the semiconductorsubstrate; forming a conductive layer over the first dielectric layer;forming a second dielectric layer over the conductive layer and thefirst dielectric layer; forming a first through hole passing through thesecond dielectric layer, the conductive layer, and the first dielectriclayer; and forming a first conductive structure in and over the firstthrough hole, wherein the first conductive structure comprises a firstconductive via and a first conductive pad, the first conductive via isin the first through hole and electrically connected to the conductivelayer and the first conductive line, the first conductive pad is overthe first conductive via, the conductive layer is made of a firstmaterial having a first resistance, and the first resistance is higherthan a second resistance of a second material of the first conductivestructure.
 17. The method for forming the chip structure as claimed inclaim 16, wherein the conductive layer comprises a conductive line, andthe conductive line has a wavy shape.
 18. The method for forming thechip structure as claimed in claim 17, wherein the conductive line has afirst end portion and a second end portion, and the first conductive viapasses through the first end portion.
 19. The method for forming thechip structure as claimed in claim 18, further comprising: forming asecond through hole passing through the second dielectric layer, thesecond end portion, and the first dielectric layer during forming thefirst through hole passing through the second dielectric layer, theconductive layer, and the first dielectric layer; and forming a secondconductive structure in and over the second through hole, wherein thesecond conductive structure comprises a second conductive via and asecond conductive pad, the second conductive via is in the secondthrough hole and electrically connected to the conductive layer, and thesecond conductive pad is over the second conductive via.
 20. The methodfor forming the chip structure as claimed in claim 16, wherein theconductive layer is thinner than the first conductive pad.